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氮化铝陶瓷产品

Aluminum Nitride Ceramic

产品介绍

Performance Introduction

氮化铝（AlN）陶瓷兼具高导热、高绝缘、热膨胀匹配三大核心特性，是功率电子与先进散热领域的优选材料。AlN陶瓷的散热能力是氧化铝（Al₂O₃）的5倍以上，并保持陶瓷优异的电绝缘性；AlN陶瓷无毒性、安全环保，更易加工。AlN陶瓷与硅、碳化硅、氮化镓等主流半导体芯片热膨胀匹配良好，可显著降低封装热失配应力。AlN陶瓷的力学强度和化学稳定性出色，适合严苛服役环境。

Aluminum nitride (AlN) ceramics combine three key properties: high thermal conductivity, high electrical insulation, and thermal expansion compatibility, making them the preferred material in power electronics and advanced thermal management applications. The heat dissipation capability of AlN ceramics is more than five times that of alumina (Al₂O₃), while maintaining excellent electrical insulation. They are non-toxic, safe, environmentally friendly, and easier to process. They exhibit good thermal expansion compatibility with mainstream semiconductor chips such as silicon, silicon carbide, and gallium nitride, significantly reducing thermal mismatch stress in packaging. AlN ceramics also feature excellent mechanical strength and chemical stability, making them suitable for demanding service environments.

产品规格

Product Specifications

性能特点

Performance Characteristics

• 高热导率 High thermal conductivity
• 低热膨胀系数 Low coefficient of thermal expansion
• 介电常数低、介电损耗小 Low dielectric constant and low dielectric loss
• 体电阻率和介电强度高 High volume electrical resistivity and dielectric strength
• 机械性能优良 Excellent mechanical properties
• 耐化学腐蚀 Resistant to chemical corrosion

应用场景

Applications

性能指标

Typical property parameters