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透明陶瓷晶圆片

透明陶瓷晶圆片

Transparent Ceramic Wafers

产品规格

Product Specifications

直径 Diameter (inch)	规格 Specifications	厚度 Thickness (mm)
Ø4 ~ 12	双平口 / Notch口晶圆 double-flat / notch wafers	≥ 0.3

*其他尺寸及开口可定制

Custom sizes and flat/notch configurations available

性能特点

Performance Characteristics

近紫外至中红外波长范围内透明性能优异 Excellent optical transparency from near-ultraviolet to mid-infrared wavelengths
高强度、高硬度、高刚性 High strength, high hardness, and high stiffness
高热导率 High thermal conductivity
低热膨胀系数 Low coefficient of thermal expansion
耐热和耐化学腐蚀 Heat resistance and chemical corrosion resistance
高电绝缘、低介电损耗 High electric insulation and low dielectric loss
加工性能显著优于蓝宝石，低残余应力 The machinability significantly superior to that of sapphire, with low residual stress

应用场景

Applications

性能指标

Typical property parameters

项目	数值
杨氏模量 (GPa)Young's modulus	300
泊松比Poisson's ratio	0.26
弯曲强度 (MPa)Bending strength	460
断裂韧性 (MPa·m^1/2)Fracture toughness	2.56
维氏硬度 (GPa)Vickers hardness	16.05
比热容（@25°C）J/(g·°C)Specific heat capacity	0.95
热导率（@25°C）W/(m·K)Thermal conductivity	15.80
热膨胀系数（25-500°C）×10⁻⁶ K⁻¹Thermal expansion coefficient	7.36
介电常数（@24-77GHz）Dielectric constant	8.75
介电损耗（@24-77GHz）×10⁻⁴Dielectric loss	2.90
介电强度 (kV/mm)Dielectric strength	66.32
体积电阻率 (×10¹⁴ Ω·cm)Volume electrical resistivity	1.62
TTV (μm)Total thickness variation	< 5
WARP (μm)Warp	< 30
S_a (nm)Surface roughness	< 1

表面显微照片

Optical Microscope Image

本公司透明陶瓷晶圆片表面光学显微镜照片｜ The optical microscope image of the surface of the transparent ceramic wafer

透明陶瓷晶圆片咨询：13163368072